Detection Index And Method Of Diamond Circular Saw Blade Substrate

The base of diamond circular saw blade is generally a slotted disc composed of 65Mn, T12 and other materials, which is formed by quenching + medium temperature tempering heat treatment. Its processing requirements have two requirements: dimensional accuracy and shape and position accuracy. Dimensional accuracy requirements include: outer diameter, inner diameter, thickness, nozzle, gear table. Geometric accuracy includes: roundness, concentricity, straightness, parallelism, radial runout, and end face yaw.

The diamond saw blade in the sawing work must ensure that the deformation is small and the rigidity is good, so that the thickness of the sawed slate can be uniform and the plate rate can be high. To meet these requirements, the saw blade must be leveled and stressed several times. The smaller the flatness and end jump values, the more uniform the stress. The better the use of the saw blade. At present, the most advanced stress testing and processing equipment in the world integrates the leveling and testing of the saw blade substrate. composition. Working principle: First, the high-precision laser sensor is used to measure the various indicators of the substrate, and then the PC software control unit judges whether the indicators meet the requirements, so as to decide whether to issue instructions to the stress rolling unit, flatness and end jump correction unit , to correct the matrix. It can realize the integrated automatic processing of the four indicators of tension, end jump, radial jump and flatness.

For flatness and end-jump detection, it takes the flange plane as the reference plane, slides on the precision guide rail through the laser sensor, and detects the distance between the highest point and the lowest point of the surface of the substrate and the reference plane when the substrate rotates. At present, some devices also take the highest point and the lowest point on the 50mm2 area as the research object, and are particularly sensitive to the "package" on the surface of the substrate, which is visually displayed on the display screen. If the substrate is qualified, the points on the substrate surface are evenly distributed in a small control zone centered on the reference plane.

For the detection of matrix stress, a constant deformation is pre-added to the matrix, and then the deformation of the matrix in the 90-degree direction is detected by a laser sensor, so that the detection of matrix stress is quantified, and the stress detection due to thickness and other factors is avoided. Impact.